Samsung fans have been gluing their eyes on the launch date of Samsung’s multi-chip package for a while now. Well, guess what? On Tuesday, Samsung Electronics announced that the mass production of the company’s best-performing chip package has begun. Samsung’s new multi-chip package will be present in mid-to-high-end smartphones.
So far, the leaks suggest that this chipset will be a real breakthrough in the tech industry. However, will new phone models (with this chipset) truly give a tough competition?
Moreover, Samsung’s new multi-chip package will be the first-ever Low-Power Double Data Rate (LPDDR) Universal Flash Storage (UFS) Multi-Chip Package set out for production.
Also, it provides a union of LPDDR5 memory and UFS 3.1 NAND storage. These will make 5G accessible to a larger range of smartphone users.
Some more features of Samsung’s Latest Multi-Chip Set
Based on the latest mobile DRAM and NAND interfaces, Samsung’s new multi-chip package can give high storage capacity and faster speed with low power. This means that many more can get access to features like augmented reality, graphics-intensive gaming, and advance photography.
Improvement in DRAM performance has led to these new facilities that were previously only available on flagship models. The DRAM performance touches almost 50 percent, from 17 to 25 gigabytes.
The doubling of NAND flash’s speed and performance has also brought about this change. These clearly defeat older smartphone memory solutions like the LPDDR4X-based UFS 2.2 solution.
Samsung’s new multi-chip package uses DRAM and NAND storage to bring space efficiency within the smartphone. A more compact package welcomes space for other features. Do you know what’s even crazier? The multi-chip package offers customizing options depending on 5G smartphone model with different storage capacities.
According to Samsung, this new solution has passed the compatibility test with intended smartphone models. Handsets with this chip will be available by the end of this month.
Will Samsung’s new LPDDR5 uMCP sustain the rich legacy of memory advancements and packaging know-how of the company? To find out the answer, we need to wait a little more. Till then, help us by letting us know your thoughts in the comments below.
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